Solder Balls are high-precision BGA reballing components designed for micro-soldering and chip-level repairs on smartphones, tablets, laptops, and motherboard PCBs.
Key Specifications
Composition: Leaded alloy made of Sn63/Pb37 (63% Tin / 37% Lead). (Note: If you need a lead-free option, the corresponding model is the XZW10).
Diameter:0.5mm uniform size with high sphericity and purity to avoid surface defects during placement.
Quantity: Typically packaged with approximately 10,000 pieces per bottle, featuring an anti-spill bottle plug.
The MECHANIC XZ10 (0.2mm) Solder Balls are highly precise BGA reballing beads engineered for fine-pitch micro-soldering, IC chip rework, and mobile phone or PCB board-level repairs. They are essential for creating reliable connections on small components like basebands, CPUs, and hard disk chips.
Key Specifications & Options
Diameter: 0.2mm, perfect for very tight, small-pitch microelectronics.
Quantity: Typically 10,000 pieces per bottle (10K).
Alloy Composition: They are available in two main variants depending on your repair requirements:
Leaded (Sn63/Pb37): 63% Tin / 37% Lead, offering a lower melting point and excellent thermal fatigue resistance.
