MECHANIC S60 BGA/IC GLUE REMOVING LIQUID FOR IPHONE - Glue Remover

The MECHANIC S60 BGA/IC Glue Removing Liquid is a professional-grade adhesive cleaning solution used by mobile-phone and PCB repair technicians. It is specifically formulated to safely soften and dissolve tough black glue, epoxy underfill, and resin sealants from delicate electronic components like iPhone logic boards, CPUs, and NAND chips without damaging the underlying PCB tracks or solder pads.