C1. High thermal conductivity of 6.0W/MK, allowing the thermal paste to quickly fill the tiny gaps in electronic components, rapidly conducting and dissipating heat generated by high-power CPUs/GPUs. 2. High voltage and high temperature resistance, safe and stable. 3. Strong thermal conductivity and heat dissipation performance. 4. Strong insulation performance, providing comprehensive protection. 5. Provides excellent heat dissipation performance and worry-free insulation protection for electronic devices, suitable for various scenarios such as Apple iPhone and Android phones, high-power LED modules, and integrated chips.
