Mechanic Dr.X Pro 1.5M No-residue Precision Solder Wick for Motherboard BGA Repair

Features:

• 99.9% Premium Oxygen-Free Copper, 35% Significantly Enhanced Solder Absorption

• Specially Treated Edges: Securely bonded and precisely finished edges eliminate concerns about fraying, ensuring longer-lasting, more reliable performance 

• Proprietary Distilled Flux Dispersion Process Ensures uniform adsorption of activating agents, Penetrates deep into the braid's interstices. Boosts Solder Adsorption Capacity by 50%

• Patented Double-Layer High-Density Weave: Offers 100% greater solder capacity compared to single-layer braids. Effortlessly handles large solder joints and multi-pin components, reducing replacement frequency